May 10, 2017 - Bostik News Flexible Packaging

Bostik to Present, Sponsor, Exhibit at Multilayer Packaging Films Conference

Bostik, a leading global adhesive specialist for the industrial, construction and consumer markets, will present, sponsor and exhibit at the Multilayer Packaging Films Conference June 27-28, 2017 in Chicago, IL.

Organized by Applied Market Information, this conference is the leading international business and technology event for the specialty flexible packaging industry. It serves as a forum for a range of current technical and commercial issues, such as new films and materials, barrier properties and testing as well as production technology.

Located in the Chicago Marriott O’Hare, 2017 marks the event’s 8th edition, providing a unique collaboration opportunity for resin and additive manufacturers, film processors, brand owners and more. In addition to seminars ranging from market overviews to improving performance, the conference will feature an exhibit hall.

Speaking in advance of the event, Corey Schoenherr, Bostik’s Packaging Business Development Manager said, “We look forward to participating in this year’s conference and appreciate the opportunity to share and build upon our industry knowledge of the flexible packaging market. We believe M-Resin is an exciting advancement in packaging technology, enhancing consumer satisfaction by improving the functionality of lidded trays and preserving foods longer.”

At the conference, Bostik’s R&D Manager, Dr. Christophe Robert, will co-present with Arkema’s Technical Development Manager, Dr. Richard Rebizak, on the importance of tie layer characteristics in oxygen barrier, reclosable packaging. This presentation will provide insight into the critical role tie layers play in the overall performance of multilayer packaging. It will also discuss the advantages of choosing the right tie resin bonding layer.

Additionally, the company will feature its smart M-Resin adhesive technology, ideal for resealable, multi-serve food packaging applications. This technology, which is blow extruded in a multilayer format, works seamlessly on existing sealing equipment.

Bostik will also sponsor a coffee break during the conference to aid in networking with other industry professionals.

Register today to attend the Multilayer Packaging Films conference. Once at the event, be sure to visit Bostik to learn how the company’s smart adhesive solutions can improve manufacturing processes, saving customers time and money.

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