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September 11, 2017 - Rigid Packaging

Introducing Kizen®: Next Generation Hot Melt Adhesives for Case and Carton Sealing

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, is proud to announce the launch of its newest product line, Kizen, the next generation of hot melt adhesives for case and carton sealing.

Based on a water-white technology, Kizen’s name represents the fusion of Japanese words “Kai”, meaning “change”, and “Zen”, meaning “better”. Designed for ease of use and strong bond performance, Kizen offers distinct advantages over current EVA and metallocene options. These advantages enable packaging plants to reduce downtime, consolidate SKUs, streamline production efficiencies and decrease overall packaging costs.Kizen

“By understanding the packaging market’s megatrends and manufacturers’ pain points, we saw an opportunity for our team to formulate a new hot melt adhesive that successfully addresses common issues while improving overall packaging aesthetics and worker safety,” said Erik Turtinen, Global Product Line Manager for Industrial Adhesives.

Comprised of two products, Kizen FORCE, for all-purpose needs, and Kizen ICE, for freezer grade applications, the Kizen product line works well on auto-feed systems, offering ultra-precise drops, good thermal stability and low clogging. It also possesses a broad processing window and can meet a variety of bonding needs across many production lines. Furthermore, Kizen has fast set speeds, low viscosity, excellent specific adhesion and superior fiber tear. These capabilities enable it to work well under short compression times, adhere to difficult substrates, such as highly recycled corrugated and withstand a range of end use temperatures.

For more information on how Kizen can help your company, visit www.bostik.com/kizen, or call 800-7-BOSTIK today.

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