Low temperature heat seal film are commonly used to package food products and consumer goods. These films are comprised of a heat seal resin coating that bonds the two substrates together using pressure and heat.
While common technology for heat seal films creates effective bonds, it is often expensive.
Take a look at an alternative option that can lower costs while improving operational efficiencies.
Common Heat Seal Coating Technology
Common low temperature heat seal films include water-based or solvent-based coatings that use the following technology in their formulations:
- Polyvinylidene chloride
- Ethylene acrylic acid
However, these coatings often require priming to properly prepare the base film for suitable coating anchorage. This priming adds time and cost to package production lines.
Alternative Heat Seal Coating Technology
To address this issue, Bostik developed a smart low temperature heat seal coating that does not require priming. Instead, it is able to adhere to many commonly used substrates, such as:
This adhesion is achieved through the use of certain resins that offer the ability to adhere to low surface energy substrates without the need for a primer.
By not needing a primer, this alternative coating is able to keep production lines moving more quickly and efficiently, helping keep costs lower.